Surface Preparation - activator, solvent-based. Low temperature curing, also known as LOCTITE 7649.
LOCTITE SF 7649 is designed to promote the curing speed of LOCTITE anaerobic adhesives and sealants without any significant loss of joint strength. It is especially recommended for applications with passive metals or inert surfaces and with large bond gaps. LOCTITE SF 7649 is particularly recommended when the application temperature is below 15 degrees.
Increases cure speed on passive and inactive surfaces
For large bond gaps
For low-temperature curing (<5 degrees)